Simulation, Measurement and Modeling of Orthogonal On-Chip Interconnects
Abstract
This paper explains the appearance of resonant frequency due to underlayer orthogonal metal grid in microstrip line structures. In the context of global interconnects, this resonant frequency may lead to noise and has to be estimate. A model, which allows one to approximate this resonant frequency, is validated by measurement.
| Origin | Files produced by the author(s) |
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