Simulation, Measurement and Modeling of Orthogonal On-Chip Interconnects

This paper explains the appearance of resonant frequency due to underlayer orthogonal metal grid in microstrip line structures. In the context of global interconnects, this resonant frequency may lead to noise and has to be estimate. A model, which allows one to approximate this resonant frequency, is validated by measurement.

Domains

Micro and nanotechnologies/Microelectronics

Fichier principal

Orthogonal_Interconnects_EPEP_2006.pdf (3.27 Mo)

Origin : Files produced by the author(s)

Denis Le Berre : Connect in order to contact the contributor

https://hal.univ-brest.fr/hal-00492786

Submitted on : Thursday, June 17, 2010-8:48:22 AM

Last modification on : Friday, March 24, 2023-2:52:53 PM

Long-term archiving on: Monday, September 20, 2010-5:10:13 PM

Dates and versions

hal-00492786 , version 1 (17-06-2010)

Identifiers

HAL Id : hal-00492786 , version 1

Cite

Yves Quéré, Thierry Le Gouguec, Pierre-Marie Martin, Denis Le Berre, Fabrice Huret. Simulation, Measurement and Modeling of Orthogonal On-Chip Interconnects. 15th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP, Oct 2006, Scottsdale, United States. pp.153-156. ⟨hal-00492786⟩

Export

BibTeX XML-TEI Dublin Core DC Terms EndNote DataCite

Collections

UNIV-BREST INSTITUT-TELECOM CNRS LAB-STICC_UBO LAB-STICC

89 View

461 Download