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Simulation, Measurement and Modeling of Orthogonal On-Chip Interconnects

Abstract : This paper explains the appearance of resonant frequency due to underlayer orthogonal metal grid in microstrip line structures. In the context of global interconnects, this resonant frequency may lead to noise and has to be estimate. A model, which allows one to approximate this resonant frequency, is validated by measurement.
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Contributor : Denis Le Berre Connect in order to contact the contributor
Submitted on : Thursday, June 17, 2010 - 8:48:22 AM
Last modification on : Monday, October 11, 2021 - 2:22:32 PM
Long-term archiving on: : Monday, September 20, 2010 - 5:10:13 PM


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  • HAL Id : hal-00492786, version 1


Yves Quéré, Thierry Le Gouguec, Pierre-Marie Martin, Denis Le Berre, Fabrice Huret. Simulation, Measurement and Modeling of Orthogonal On-Chip Interconnects. 15th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP, Oct 2006, Scottsdale, United States. pp.153-156. ⟨hal-00492786⟩



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