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Derniers dépôts
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Simon Chouteau, L. Stafford, Agnès Granier, Antoine Goullet, Mireille Richard-Plouet. Handling Nanoparticle Content in Nanocomposite Thin Films Deposited by Misty Plasma Processes through Controlled Flash Boiling Atomization. Langmuir, 2024, 40 (6), pp.3015-3023. ⟨10.1021/acs.langmuir.3c03176⟩. ⟨hal-04549282⟩
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Issraa Shahine, Quentin Hatte, Maxime Harnois, Pierre-Yves Tessier. Large Area Freestanding Au Nanoporous Ultrathin Films Transfer Printed on Bendable Substrates and 3D Surfaces for Flexible Electronics. ACS Applied Electronic Materials, 2024, 6 (4), pp.2281-2288. ⟨10.1021/acsaelm.3c01771⟩. ⟨hal-04552765⟩
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Pascal Bargiela, Vincent Fernandez, Christophe Cardinaud, John Walton, Mark Greiner, et al.. Towards a reliable assessment of charging effects during surface analysis: Accurate spectral shapes of ZrO2 and Pd/ZrO2 via X-ray Photoelectron Spectroscopy. Applied Surface Science, 2021, 566, pp.150728. ⟨10.1016/j.apsusc.2021.150728⟩. ⟨hal-03355769⟩
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Allan Lebreton, Marie-Paule Besland, Pierre-Yves Jouan, Tatiana Signe, Cédric Mannequin, et al.. Control of microstructure and composition of reactively sputtered vanadium nitride thin films based on hysteresis curves and application to microsupercapacitors. Journal of Vacuum Science & Technology A, 2024, 42 (2), pp.023405. ⟨10.1116/5.0177028⟩. ⟨hal-04423908⟩
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Michael Rodriguez-Fano, Mohamad Haydoura, Julien Tranchant, Etienne Janod, Benoît Corraze, et al.. Enhancing the Resistive Memory Window through Band Gap Tuning in Solid Solution (Cr1–xVx)2O3. ACS Applied Materials & Interfaces, 2023, 15 (47), pp.54611-54621. ⟨10.1021/acsami.3c09387⟩. ⟨hal-04361024⟩
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J. Zgheib, L. Berthelot, J. Tranchant, N. Ginot, M.-P. Besland, et al.. Electron-enhanced high power impulse magnetron sputtering with a multilevel high power supply: Application to Ar/Cr plasma discharge. Journal of Vacuum Science & Technology A, 2023, 41 (6), pp.063003. ⟨10.1116/6.0002857⟩. ⟨hal-04299303⟩
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T Meyer, A Girard, M Bouška, E Baudet, M Baillieul, et al.. Mass spectrometry and in situ x-ray photoelectron spectroscopy investigations of organometallic species induced by the etching of germanium, antimony and selenium in a methane-based plasma. Plasma Sources Science and Technology, 2023, 32 (8), pp.085003. ⟨10.1088/1361-6595/aceaa5⟩. ⟨hal-04186877⟩
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Anthony Valero, Adrien Mery, Dorian Gaboriau, Marc Dietrich, Maggie Fox, et al.. Redefining high-k dielectric materials vision at nanoscale for energy storage: A new electrochemically active protection barrier. Electrochimica Acta, 2021, 389, pp.138727. ⟨10.1016/j.electacta.2021.138727⟩. ⟨hal-03355843⟩
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Rémi Dussart, Thomas Tillocher, Gaelle Antoun, Jack Nos, Philippe Lefaucheux, et al.. Plasma cryogenic etching processes: what are the mechanisms involved at very low temperature ?. 14th EU-Japan Joint Symposium on Plasma Processing (JSPP) 2023, Satoshi Hamaguchi, Apr 2023, Okinawa, Japan, Japan. ⟨hal-04072312⟩
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Nombre de documents
Nombre de notices
277
Mots-clés
Residual stress
CaTiO3Pr^3^+
Biomasse
X-ray photoelectron spectroscopy
Chemical detection
TiO2
BOMBARDMENT
PECVD
Non-volatile memory
B1 Inorganic compounds
Alzheimer's disease
Avalanche breakdown
Ablation laser
CIGSe
CHLORINE PLASMAS
B Chemical synthesis
Mott insulators
Band gap
A-CNx
Aryl-diazonium salts
Films
Anatase
Carbon nanotubes
Chalcogenides
Sputtering
Optical properties
Plasmas froids
Applications industrielles
Carbon nitride
Transmission electron microscopy
Thin film
Selenization
A3 Physical vapor deposition processes
AuCu alloy
Ambipolar material
NEXAFS
Vanadium Sesquioxide
Magnetron sputtering
A1 Characterization
Kirkendall effect
B2 Quaternary
Aluminium nitride
Band alignment
Amorphous
Bixbyite
Plasma etching
SF 6
Mott insulator
Cathepsin
Structure
3 nm in size
Thin films
CH4
Sol-gel
AZO thin films
XPS
A Multilayers
V2O3
TEM
Nanotubes
Colloidal solution
B3 Solar cells
AlN
B2 Semiconducting alloys
Semiconductors
Biofilms microbiens
Chalcogenide
Amyloid precursor
C Photoelectron spectroscopy
Calcined clay
Functionalization
Transfert d'énergie
A Chalcogenides
Argon InP chlorine etching inductive coupled plasma ICP modeling plasma sheath simulation
Atomic force microscopy
Bipolar resistive switching BRS
X-ray diffraction
Scanning electron microscopy
Copper
Capacitance
Chalcogenide glass
Low-pressure plasma processing
CNTs’ collapse
Oxides
Carbon
Atomic layer etching
Alloying
Titanium dioxide
Etching
B2 Semiconducting indium compounds
Adsorption
Physical vapor deposition
Spectroscopic ellipsometry
Resistive switching
Buffer Couple
Chemical and biological sensors
Nanocomposite
Carbon Nanotube
Biocapteurs
A Thin films