Electromagnetic Interference (EMI) of System-on-Package (SOP), IEEE trans on Advanced Packaging, vol.27, issue.22, pp.304-314, 2004. ,
Frequency Domain Analysis of Transmission Zeroes on High-Speed Interconnects in the Presence of an Orthogonal Metal Grid Underlayer Impact by an Orthogonal Metal Grid upon Differential-and Common-Mode Characteristics of Coupled Lines in PCB Technology Structures, IEEE trans on Advanced Packaging, vol.4, issue.3, pp.684-691, 2008. ,