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SPLC '19: Proceedings of the 23rd International Systems and Software Product Line Conference - Volume A2019
Proceedings/Recueil des communications
hal-02386136v1
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REVaMP 2 Project: Towards Round-Trip Engineering of Software Product Lines -Approach, Intermediate Results and ChallengesInternational Conference on Objects, Components, Models and Patterns (TOOLS 2019), Oct 2019, Innopolis, Russia. pp.406-417, ⟨10.1007/978-3-030-29852-4_34⟩
Communication dans un congrès
hal-02428581v1
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Validate, Simulate and Implement ARINC653 Systems using the AADLACM SIGAda Ada Letters, 2009, 29 (3), pp.31-44. ⟨10.1145/1653616.1647435⟩
Article dans une revue
hal-00745370v1
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